Rogers PCB Manufacturer PCB Fabrication & Supplier
Need Rogers PCB in the USA? OurPCB provides high-quality Rogers PCBs for telecommunications, automotive, RF engineering, aeronautics, and computer systems.
- Professional Engineering Review: Expert engineers ensure precision and reliability.
- Strict Quality Control: AOI testing, E-testing, X-RAY, and impedance control guarantee top performance.
- Competitive Pricing: Specializing in multilayer PCBs at cost-effective rates.











Types of Rogers PCB Materials
Metal Claddings
- Rolled
- Electrodeposited
- Electrodeposited Reverse Treated
- Resistive Foil
Bonding Materials
- Ceramic PTFE Bondply
- Woven Glass
- Prepreg
- Hydrocarbon
- Thermoset Thermal and Electrically Conductive Adhesive (TECA) Film
Laminates
- Woven Glass Reinforced Modified Epoxy Laminates
- PTFE Random Glass Fiber
- Woven Glass UL 94 V-0 laminates
- Hydrocarbon
- PTFE Ceramic
- Cross-Plied Woven Glass-Reinforced PTFE
- Woven Glass Reinforced PTFE Antenna Grade Laminates
- Filled PTFE Composite
- Woven Glass Reinforced Modified Epoxy IMS
PCB Manufacturing Process







Rogers PCB Applications
Rogers PCBs offer advanced materials tailored for high-frequency, RF, and microwave applications. Each model provides unique benefits, from low dielectric loss to high thermal stability, making them ideal for industries like telecommunications, automotive radar, and 5G technology. Below is a breakdown of key Rogers PCB models and their applications.




The Rogers 4350B has a low loss capability and stable control on its dielectric constant (DK), makes its materials ideal for high power RF designs and super-active appliances.
This Rogers PCB model is suitable for automotive radar applications with 77 GHz, and it also supports 5G wireless applications and ADAS.
The 3006 model offers excellent mechanical and electrical stability—with a reliable dielectric constant across various temperatures. And it removes the step change in the Dk.
The 3010 is one of the most affordable models with advanced ceramic-filled PTFE materials. Hence, its stability streamlines the broadband components.
Reinforced with glass microfibers, the Rogers 5880 has a low DK and loss feature. Hence, it makes the model highly suitable for broadband and high-frequency applications.
The 6002 model comes with low DK materials that are ideal for sophisticated microwave structures. Hence, it’s ideal for multi-layer board designs.
This RO6010 is ideal for microwave and electronic board applications that require a high DK. Also, the model is ideal—if you plan on dealing with circuit size reduction.
The Rogers 4003 model uses 1674 and 1080 glass fabric styles. All its configurations have the same specifications; they don’t support bromination.
This 4835 laminate is a low-loss material that provides high stability at significant oxidation resistance and increased temperatures. With it, you’ll get a standard glass or epoxy FR-4 processes and cheap circuit production.
This laminate offers a perfect balance of processing capability and performance. Plus, the low-loss laminate consists of hydrocarbon ceramic-filled thermostat materials.
Data Sheet Showing the Different Roger PCB Models (Table 1)
Property | RO4350B | RO3003 | RO3006 | RO3010 | RO4835 | RO5880 | RO6002 | RO6010 | RO4003 | RO 4360G2 |
---|---|---|---|---|---|---|---|---|---|---|
Dk, Process | (2)3.48 ± 0.05 | 3.00 ± 0.04 | 6.15 ± 0.15 | 10.2 ± 0.30 | 3.48 ± 0.05 | 2.20 ± 0.02 | 2.94 ± 0.04 | 10.2 ± 0.25 | 3.38 ± 0.05 | 6.15 ± 0.15 |
Dk Design | 3.66 | 3.00 | 6.50 | 11.20 | 3.66 | 2.20 | 2.94 | – | 3.55 | – |
Dissipation Factor | 0.0037 0.0031 | 0.001 0 | 0.002 0 | 0.002 2 | 0.003 7 | 0.0004 0.0009 | 0.001 2 | 0.002 3 | 0.0027 0.0021 | 0.003 8 |
Thermal Coefficient | +50 | -3 | -262 | -395 | +50 | -125 | +12 | -425 | +40 | – |
Dimension Stability | – | -0.06 0.07 | -0.27 -0.15 | -0.35 -0.31 | – | – | – | – | – | – |
Volume Resistivity | 1.2 X 10^10 | 10^7 | 10^5 | 10^5 | 5 x 10^8 | 2 x 10^7 | 10^6 | 5 x 10^5 | 1.7 X 10^10 | 4.0 x 10^13 |
Surface Resistivity | 5.7 X 10^9 | 10^7 | 10^5 | 10^5 | 7 x 10^8 | 3 x 10^7 | 10^7 | 5 x 10^6 | 4.2 X 10^9 | 9.0 x 10^12 |
Electrical Strength | 31.2 (780) | – | – | – | 30.2 (755) | 0.96 (0.23) | – | – | 31.2 (780) | 784 |
Tensile Modulus | 16,767 (2,432) 14,153, (2,053) | 930 823 | 1498 1293 | 1902 1934 | 7780 (1128) | 1070 (156) 450 (65), 860 (125) 380 (55) | 828 (120) | 931 (135) | 19,650 (2,850) 19,450 (2,821) | – |
Table 2 (Continuation)
Property | RO4350B | RO3003 | RO3006 | RO3010 | RO4835 | RO5880 | RO6002 | RO6010 | RO4003 | RO 4360G2 |
---|---|---|---|---|---|---|---|---|---|---|
Tensile Strength | 203 (29.5) 130 (18.9) | – | – | – | 136 (19.7) | – | – | 17 (2.4) | 139 (20.2) 100 (14.5) | 131 (19) 97 (14) |
Flexural Strength | 255 (37) | – | – | – | 186 (27) | – | – | 4364 (633) | 276 (40) | 213 (31) 145 (21) |
Dimensional Stability | <0.5 | – | – | – | <0.5 | – | – | – | <0.3 | – |
Coefficient of Thermal Expansion | 10 12 32 | 17 16 25 | 17 17 24 | 13 11 16 | 10 12 32 | 31 48 237 | 16 16 24 | 24 24 24 | 11 14 46 | 13 14 28 |
Tg | >280 | – | – | – | >280 | – | – | – | >280 | >280 |
Td | 390 | 500 | 500 | 500 | 390 | 500 | 500 | 500 | 425 | 407 |
Specific Heat | – | 0.9 | 0.86 | 0.8 | – | – | 0.93 (0.22) | 1.00 (0.239) | – | – |
Thermal Conductivity | 0.69 | 0.50 | 0.79 | 0.95 | 0.66 | 0.22 | 0.60 | 0.78 | 0.71 | 0.75 |
Moisture Absorption | 0.06 | 0.04 | 0.02 | 0.05 | 0.05 | 0.02 | 0.02 | 0.05 | 0.06 | 0.08 |
Density | 1.86 | 2.1 | 2.6 | 2.8 | 1.92 | 2.2 | 2.1 | 3.1 | 1.79 | 2.16 |
Copper Peel Strength | 0.88 (5.0) | 12.7 | 7.1 | 9.4 | 0.88 (5.0) | 31.2 (5.5) | 8.9 (1.6) | 12.3 (2.1) | 1.05 (6.0) | 5.2 (0.91) |
Flammability | (3)V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | 94V-0 | N/A | V-0 |
Lead-Free Process Compatible | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | – |







PCB Assembly Services

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PCB Board Process
Order Received
- Component Procurement
- Preparation
- PCB Manufacture
- Make Process Flow
Soldering
- Solder Printing/Wave Soldering
- SMT/Plugging
- Inspection (repair if necessary)
- AOI (repair if necessary)
- Transfer
Parts Assembly
- Manual Assembly
- Cleaning
- Wire Screw
- Inspection
- Repair If Necessary
Finalization
- Final Confirmation
- Packing
- Shiping
Technical Capabilities




Capabilities & Services
- One-stop PCBA Services (PCB Manufacturing + Components Sourcing + Assembly)
- SMT + THT Assembly
- BGA Rework
- 60,000 Chips/Hour
- Down to 01005/0210 Size
- Accuracy<±40μm
- Min. QFN Pin Width/Space: 0.15mm/0.25mm
- Min. QFN BGA Diameter/Space: 0.2mm/0.35mm
- Rigid, Flex, HDI, & High-speed Power Boards
- Up to 50 Layers
- 60GHz High Frequencies
- Min. Trace Width/Spacing: 2.5mil/2.5mil
- AOI, X-ray, ICT & FCT Testing
- Controlled Impedance
- ISO 9001, ISO 13485, ISO 14001, IATF 16949, IPC-A-610, UL Certified
- Automotive, Medical, & Military-grade PCBA Manufacturing
Technical Capabilities


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Rogers PCB Manufacturer FAQs
How do FR-4 and Rogers materials compare in terms of key factors?
Factor | FR-4 Material | Rogers Material |
---|---|---|
Dissipation Factor (DF) | 0.020 | 0.004 |
Price | Affordable | Expensive |
Thermal Management | Does not handle high temperatures well. | Excellent high-temperature management. |
Performance | Decent | Remarkable |
Dielectric Constant (DK) | 4.5 | 6.15 to 11 |
Impedance Stability | Lower polarity; does not stabilize charges well. | Higher polarity; stabilizes charges effectively. |
Applications | Not ideal for space applications (poor outgassing tolerance). | Suitable for space applications due to reduced outgassing. |
Which material is better for high-frequency applications?
Rogers material is preferred for high-frequency applications due to its low dissipation factor (DF) and stable dielectric constant (DK), which improve signal integrity.
Why is Rogers material more expensive than FR-4?
Rogers material is engineered for superior thermal management, impedance stability, and high-frequency performance, making it more costly than standard FR-4.
When should I choose FR-4 over Rogers material?
If cost is a primary concern and the application does not require high-frequency performance or extreme temperature resistance, FR-4 is a good choice.
What makes Rogers PCB a superior choice for certain applications?
Rogers PCB offers several advantages, making it ideal for high-performance applications:
- Low Moisture Absorption: Performs well in humid environments without significant degradation.
- Low Thermal Expansion & Dimensional Stability: Maintains structural integrity under various conditions.
- Thin and Easy to Fabricate: With a thickness as low as 0.1mm, it is compatible with complex designs.
- Excellent Thermal Management: Suitable for electronic devices and circuits that generate excess heat.
- Reduced Outgassing: Ideal for space applications due to minimal gas release.
- Enhanced Impedance Control: Ensures better signal integrity by maintaining trace locations and dimensions.
- Steady High-Frequency Performance: Provides reliable performance in high-frequency applications.
Why is Rogers PCB preferred for high-frequency circuits?
Rogers PCB offers superior impedance control and stable dielectric properties, ensuring minimal signal loss at high frequencies.
Is Rogers PCB more durable than standard PCBs?
Yes, its low thermal expansion and excellent stability make it more durable in extreme environments.