High Tg PCB

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ABOUT HIGH TG PCB

The Tg (glass transition temperature) of a high-Tg PCB is the key to its performance. A PCB base material has different properties at various temperatures, and when it exceeds 170°C, it becomes softer than usual.

High-temperature glass transitions are often used in thermally intensive conditions like circuits mounted on top of CPUs or GPUs where heat transfers from these components can damage other sensitive electronics nearby if not cooled efficiently by good airflow with plenty of headroom for cooling; this makes them more responsive but less tolerant to higher operating temperatures that would cause problems otherwise.

In high-temperature environments, PCBs with higher Tg is more stable. The substrate of these boards also provides better mechanical and chemical stability and stronger heat resistance to the board. You can use materials such as Shengyi S1000-2, ISOLA 370HR, ITEQ-IT 180L in this environment for maximum performance.

THE FEATURES OF HIGH TG PCB

Nowadays, most electronics firms are using high Tg PCBs for computers and other crucial devices.

And it’s because these materials have several features that make them ideal for this type of work:

Excellent PTH dependability

High-value resistance for thermal stress

Great mechanical properties

It has durability for long delamination

Impervious to High Temperature

It has a low thermal expansion

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THE NECESSARY MATERIALS FOR HIGH TG PCB

Material	CTE-z (ppm/℃)	Td (Wt, ℃)	Tg (DSC, ℃)	Td288 (min)	Td260 (min)
IT180	45	345	180	20	60
S1141 (FR4)	55	300	175	/	8
Rogers 4350B	50	390	280	/	/
S1000-2M (FR4)	45	345	180	20	60

IN HIGH TG PCBS heat dissipation method

If you’re looking to guard your PCBs against the high temperatures of your appliances’ process, then high Tg PCBs are necessary. Hence, there are three important ways to dissipate heat produced by electronics with High Tg PCBs.

Conduction

In the process of conduction, heat will cool down when it's placed next to its source. This is done by using a sink for the heat that has been produced- similar to electricity flowing through an electric system.

Radiation

With a powerful enough radiation, the electromagnetic waves will create an exit path to leave.

Convection

The process of convection is a great example. It's the movement of heat to water or air, enabling it to flow out from an area. For instance, you can see this in action when using pumps and fans that push hot air over surfaces while also drawing away some of its heat with the device.

THE ADVANTAGES OF USING HIGH TG PCB

It allows for thin substrates, small apertures, and fine traces.

It has improved dimensional stability, mechanical strength, and a solid layer to layer adhesion for various temperature changes.

Resistance to high temperatures and preserves superb performance.

Increased stability, humidity, enhanced thermal, and chemical resistance

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THE CAPABILITIES OF HIGH-TEMPERATURE PCBS

High Tg Features	Capacity
Build Time:	2 days - 5 weeks
Number of Layers:	2 – 40 layers
Order Quantity:	1pc - 10000+pcs
Quality Grade:	Standard IPC 2
Copper Weight (Finished):	0.5oz - 2.0oz
Board Size:	Min 6mm x 6mm \| Max 500mm x 900mm
Material:	S1141 (FR4), S1000-2M (FR4), IT180, Rogers 4350B
Board Thickness:	0.4mm - 6.5mm
Solder Mask Sides:	As per the file
Min Tracing/Spacing:	3mil/3mil
Solder Mask Color:	Green, White, Blue, Black, Red, Yellow
Silkscreen Color:	White, Black, Yellow
Other Techniques:	Gold fingers Countersink Holes Blind/Buried Vias
Min Drilling Hole Diameter:	6mil
Min Annular Ring:	4mil
Surface Finish:	Lead-Free HASL – RoHS Immersion Silver - RoHS HASL - Hot Air Solder Leveling Immersion Tin - RoHS OSP - Organic Solderability Preservatives - RoHS ENIG - Electroless Nickel/Immersion Gold – RoHS

HIGH TG PCB TECHNICAL OPTIONS

We’re glad you’ve come to us for help with your high Tg material needs. Based on normal circumstances, the listed materials can be replaced by technically similar devices; however, if you have specific requirements that need a closer look we encourage communication so our technical team can provide support and guidance.

T260 - T288 value, Td

For all of you engineers out there, these are the T260 and T288 values representing the period of delamination at 260oC and 280oC.

CTE-z

With a low CTE-z value, an alloy can be more resistant to heat and pressure changes. This is because the metal would change volume less than if its z-axis thermal expansion was higher.
A lower Z-axis means that you have better resistance to extreme temperature fluctuations and other environmental stressors like high pressures or humid conditions since your material will expand at about the same rate as those things do.

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