Package on Package (PoP) Assembly Services
Package on Package (PoP) assembly is a method of stacking integrated circuits. It combines separate logic and memory packages into one unit. This technique saves space and boosts performance in electronic devices. OurPCB offers expert PoP assembly services for your advanced packaging needs.
Package-on-Package (POP) Assembly
PoP assembly stacks two or more IC packages on top of each other. The bottom package often contains logic chips, while the top holds memory components. This setup allows for direct vertical connections between the packages.
The assembly process precisely aligns and solders the packages. Solder balls on the bottom of the top package connect to pads on the bottom package. This creates a compact, high-performance module ideal for space-constrained applications.
PCB Manufacturing Process
The Benefits of Partnering with OurPCB for Package on Package Assembly Services
OurPCB brings expertise, quality, and efficiency to your projects with our PoP assembly services. Our advanced capabilities ensure optimal results for your semiconductor needs.
- State-of-the-art equipment for precise package alignment
- Advanced reflow systems for reliable solder connections
- Rigorous inspection processes at every stage
- Adherence to industry standards for reliability
- Support for various package types and sizes
- Custom solutions to meet specific project requirements
Why Choose Package-on-Package (POP) Technology?
PoP technology offers significant advantages for modern electronics. It combines high performance with space efficiency, making it ideal for compact devices.
- Integration of multiple chip functions in a single package
- Improved signal integrity between logic and memory
- Vertical stacking reduces PCB footprint
- Allows for smaller, more compact device designs
- Shorter interconnects between chips
- Reduced signal delays and power consumption
- Mix-and-match capability for different chip combinations
- Easier upgrades and modifications of memory components
- Integration of multiple chip functions in a single package
- Improved signal integrity between logic and memory
- Vertical stacking reduces PCB footprint
- Allows for smaller, more compact device designs
- Shorter interconnects between chips
- Reduced signal delays and power consumption
- Mix-and-match capability for different chip combinations
- Easier upgrades and modifications of memory components
PCB Assembly Services
OurPCB offers a wide range of PCB assembly services to meet diverse needs. We combine precision, quality, and efficiency in every project.
We use advanced Surface Mount Technology for high-density, compact PCB assemblies. Our SMT process ensures precise component placement and reliable connections.
We adapt to your needs, working with your supplied components or providing full turnkey solutions. Our services cover everything from sourcing to final assembly.
Our team creates tailored PCB assemblies to match your exact specifications. We handle unique designs and special requirements with skill and attention to detail.
We offer fast, high-quality PCB assembly services. Our efficient processes deliver quick turnarounds without compromising on quality or reliability.
We produce PCB assemblies that meet strict IPC Class 3 standards. This ensures top performance in critical applications like aerospace and medical devices.
We handle a wide range of IC package types in our PCB assemblies. This includes BGAs, POPs, CGAs, QFNs, DFNs, and CSPs, all assembled with precision.
Millions of business and innovators use OurPCB
Technical Capabilities
OurPCB possesses advanced technical capabilities for PoP assembly. We handle complex package stacks with precision. Our equipment allows for fine-pitch connections down to 0.4 mm. We use X-ray inspection to ensure perfect alignment and solder joint quality. Our thermal management techniques optimize heat dissipation in dense package stacks.
Capabilities & Services
- One-stop PCBA Services (PCB Manufacturing + Components Sourcing + Assembly)
- SMT + THT Assembly
- BGA Rework
- 60,000 Chips/Hour
- Down to 01005/0210 Size
- Accuracy<±40μm
- Min. QFN Pin Width/Space: 0.15mm/0.25mm
- Min. QFN BGA Diameter/Space: 0.2mm/0.35mm
- Rigid, Flex, HDI, & High-speed Power Boards
- Up to 50 Layers
- 60GHz High Frequencies
- Min. Trace Width/Spacing: 2.5mil/2.5mil
- AOI, X-ray, ICT & FCT Testing
- Controlled Impedance
- ISO 9001, ISO 13485, ISO 14001, IATF 16949, IPC-A-610, UL Certified
- Automotive, Medical, & Military-grade PCBA Manufacturing
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Sat: 9am-6pm, GMT+8
Reach us at
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+86-199-30589219
Mon-Fri: 24 hours,
Sat: 9am-6pm, GMT+8
Package on Package (PoP) Assembly Services | FAQs
What is the package on package assembly process?
The package-on-package assembly process stacks package components like a logic package and a memory chip for higher density. The PoP process involves placing the bottom PoP on the substrate, applying solder paste, and aligning the upper package. Ball grid array (BGA) connections ensure interconnection between the top and bottom packages through reflow soldering. A typical logic plus memory PoP stack improves electrical performance and integrates processor and memory efficiently.
How does thermal management differ for PoP compared to conventional PCB assembly?
The PoP manufacturing process faces more thermal challenges due to its 3D package design and higher component density. PoP provides better heat dissipation strategies by optimizing integrated circuit packaging and improving airflow. PoP allows efficient heat removal by adjusting system in package configurations and using materials like those from Indium Corporation. Unlike package in package, thermal solutions in semiconductor manufacturing must address heat transfer from the bottom of the package upwards.
What causes warpage in PoP assembly, and how is it controlled?
Warpage in PoP uses results from mismatched thermal expansion between the lower package and the upper package. Uneven reflow soldering and variations in flash memory or discrete logic and memory contribute to deformation. Techniques from advanced semiconductor engineering control warpage by adjusting baseband materials and PoP manufacturing process conditions. Moreover, maintaining even heating during assembly prevents excessive warping in embedded PoP structures.
What is SMT PoP (Package-on-Package) process?
The SMT PoP process assembles PoP uses through surface-mount technology, stacking components for higher component density. BGA and ball grid array ensure strong interconnection between the top and bottom layers. Semiconductor manufacturing advancements optimize PoP process efficiency in high-performance applications. This method enables flexible processor and memory configurations with improved advantages of PoP in miniaturized electronics.
