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PCB Failure Analysis & Common Problems

Understanding and preventing common failures in printed circuit board assembly (PCBA) is essential for ensuring the reliability and functionality of electronic projects. OurPCB offers expert PCBA services that address potential issues like solder joint fractures, component polarity errors, and thermal stresses, enhancing the overall quality and durability of your PCBs.
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The OurPCB team created two tables mapping PCB failures into DIY Hobby PCB Failures and Commercial PCB Assembly Manufacturing Failures:

DIY PCB Failures

DIY failures often stem from improper handling and design errors, while commercial manufacturing failures are more likely related to fabrication defects and large-scale assembly challenges.

DIY Hobby PCB Failures Failure causes
Physical Damages Water exposure, dust buildup, accidental drops, oxidation, vibration, heat damage
Design Flaws Incorrect component placement, poor trace design, improper material selection
Soldering Defects Cold solder joints, insufficient solder, bridging, flux contamination
Thermal Issues Overheating due to improper heat dissipation or lack of thermal vias
Open/Short Circuits Misaligned traces or solder bridges causing connectivity issues
Copper Issues Copper traces too thin or too close to board edges
Ionic Contamination Residues from poor cleaning causing corrosion or electrochemical migration
Pad Lifting Pads detaching due to excessive heat during soldering
Burned Components Overheating components due to incorrect power supply or soldering errors
Environmental Factors Heat, dust, moisture exposure during DIY handling

A technician fixing a broken PCB

(A technician fixing a broken PCB)


Commercial PCB Assembly Manufacturing Failures

Assembling PCB

Failures of Manufactured PCBs Failure causes
Manufacturing Errors Over-etching, drilling errors, misaligned layers, insufficient clearances
Plating Voids (Fabrication) Holes or gaps in circuit board plating due to deposition issues
Acid Traps (Fabrication) Acid buildup in acute angles during etching
Thermal Issues (Design & Assembly) Starved thermals, overheating due to poor thermal management
Electromagnetic Issues (Design) Poor trace layout causing EMC/EMI problems
Soldering Defects (Assembly) Cold soldering, black pad defects, outgassing
Conductive Anodic Filament Formation (CAF) Electrical failure due to conductive material growth
Interconnect Defects (Fabrication) Separation between copper filler and circuits
Measling and Delamination (Fabrication) White spots or bubbles due to poor lamination
Aging (Components) Component fatigue or breakdown over time
Chemical Leakage (Components) Corrosion or shorts caused by leaked chemicals
Mechanical Failures (Assembly) Warpage, deformation, brittle fractures
Electrical Stress Failures Electrostatic discharge (ESD), dielectric breakdown, overvoltage
Packaging Failures (Components) Cracks or overstressed wire bonds
Slivers (Fabrication) Thin pieces of copper or solder mask causing shorts

Electronic circuit board, Setup IC

(Electronic circuit board, Setup IC)

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Comprehensive Failure Analysis Techniques

Hands of engineer with a digital multimeter check computer electronic circuit board

(PCB Failure Analysis)

To address PCB failures effectively, a systematic failure analysis approach is critical:

Technique Purpose Tools Used
Electrical Testing Identifies open/short circuits Probe stations, functional testers
Signal Integrity Analysis Diagnoses waveform issues Oscilloscopes
Emission Microscopy Detects hotspots from resistance Infrared cameras
Thermal Profiling Identifies overheating components Thermal scanners
Chemical Analysis Reveals hidden defects Chemical etchants
Cross-sectioning Inspects internal layers Microscopes

How to Prevent Failures?

Failure Mode Prevention Strategy
Cracks/Bends Prebaking, humidity control
Polarity Issues Diode protection, proper labeling
Solder Joint Fractures Automated soldering, visual inspection
Corrosion Thorough cleaning after assembly
Short Circuits Electrical testing, reduced stencil thickness
Copper Weight Issues Follow design specifications
Component Misalignment Accurate pick-and-place machines
Low Warranty Components Source high-quality parts
Dewetting Cleaning and surface preparation

By following these best practices and leveraging advanced failure analysis techniques, manufacturers can significantly improve PCB reliability while minimizing rework costs and customer dissatisfaction.

References to Internal Links

OurPCB is willing to provide services on PCB and PCBA. You may ask for an online quote or email us to get in touch with our engineers.

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Hommer Zhao

Hommer Zhao, based in Shenzhen, China, founded OurPCB in 2005, a PCB Manufacturing company.

As a regular contributor to Circuit World and the Journal of Manufacturing Systems, Hommer shares expertise on advanced PCB fabrication processes. His research on manufacturing optimization appears in the International Journal of Production Research and Journal of Industrial Information Integration.

Serving on the Indian Printed Circuit Association (IPCA) advisory board, Hommer Zhao frequently presents at technical seminars and industry exhibitions. He maintains strong partnerships with leading institutions including UCL's Electronic Engineering Department and their PCB prototyping facilities. Under his leadership, OurPCB has pioneered enhanced PCB manufacturing machining capabilities for high-precision PCB manufacturing, particularly serving telecommunications, automotive, and medical device sectors.

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